Major Accomplishments - Created FEA informed process for multi-system level vibration and shock reliability risk assessment - Developed reduced order model representation of system thermal performance to inform temperature dependent electrical parameters for silicon reliability models - Utilized multi-objective optimization algorithms coupled with thermomechanical simulations to accurately calibrate and predict package warpage against shadow moiré characterization data -Reduced testing costs of 2 products/product variations through simulation based similarity qualification of warpage, thermal cycling, and strain limit characterization. Activities -Identify environmental conditions for various product life phases and translate FEA boundary conditions -Develop finite element models to asses risk of various failure modes and understand system behavior during different loading conditions (thermal, thermomechanical, structural, dynamic) for various system levels -Represent AMD in IPC/JEDEC Standardization Committees -Consult on material characterization processes (DIC/DMA) -Consult on Warpage, Bend, Shock, and Vibration Testing -Mentor less experienced engineers

National Renewable Energy Laboratory | Feb 2020 - May 2022

Graduate Research Assistant (Collaborative Appointment with Georgia Tech)

- Developed mission-based thermomechanical reliability analysis framework for power conversion systems based on physics-of-failure, transient thermo- mechanical simulations, and fidelity reduction techniques, for use in power module design tradeoff and benchmarking. - Developed high performance heat exchanger and electronics packaging design for direct cooled power electronics module using computational fluid dynamics, finite element analysis, fidelity reduction techniques, and optimization algorithms. This effort resulted in 2 patent applications. - Surveyed dielectric cooling fluid candidates and developed figures of merit to quickly compare thermo-hydraulic performance, resulting in conference publication and poster presentation at Itherm 2021. - Designed experimental assembly for thermo-fluid analysis of 3-D printed copper heat exchanger designs.

My Education

Take a look at my formal education

Doctor of Philosophy - PhD, Mechanical EngineeringGeorgia Institute of Technology | 2022

Master of Science, Mechanical EngineeringWashington State University Vancouver | 2018

Bachelor of Science (B.S.), Mechanical EngineeringWashington State University Vancouver | 2015

Associate of Science - AS, EngineeringLower Columbia College | 2013

About Me

Passionate electronics packaging technologist with the desire to improve the data usage in the electronics packaging design and qualification process.

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